Characteristics of HFIX Insulated Wire Sheaths Contaminated by Pollutants

Overview of wire bonding using copper wire or insulated wire

Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...

Stitch Bond Enhancement for X-WireTM Insulated Bonding Wire

Assembly Using X-WireTM Insulated Bonding Wire Technology

As the semiconductor industry continues to move towards higher pin count, finer pitch, multi-row and multistack devices, wire bonding becomes an increasing challenge for today’s advanced packaging processes. Insulated bonding wire technology, known as X-WireTM, has been identified on the 2006 ITRS Roadmap for Semiconductors [1], as a viable, cost-effective solution to enable complex package des...

Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

In this article, the new challenges and requirements in wire bonding are discussed, the problems in ultra-fine-pitch wire bonding and insulated wire bonding are analyzed, and then two capillary solutions to the problems are presented. Actual bonding experiments using the new capillaries were carried out and the results were satisfactory. Compared to the standard design, a new capillary design h...

Uptake and bioavailability of persistent organic pollutants by plants grown in contaminated soil.

This paper assesses the uptake of persistent organic pollutants (POP's) into plants. In particular, uptake of alpha-endosulfan, beta-endosulfan and endosulfan sulfate from lettuce. The lettuce plants were grown on compost that had previously been contaminated at 10 and 50 microg g(-1) per POP. The soil was slurry spiked by adding the appropriate amount of POP in acetone in an approximate ratio ...